What is the impurity control standard of methyl methacrylate in semiconductor packaging materials?

Methyl methacrylate in semiconductor packaging materials impurity control standards

In the semiconductor industry, the quality of packaging materials is directly related to the performance, reliability and service life of electronic devices. Methyl Methacrylate (MMA), as an important chemical raw material, is widely used in the manufacture of semiconductor packaging materials. Especially in the synthesis process of epoxy resin, MMA is one of the key monomers, and its purity and impurity content directly affect the performance of the final product. This article will analyze the application and importance of MMA in semiconductor packaging materials from the perspective of impurity control standards.

1. of methyl methacrylate in semiconductor packaging

Methyl methacrylate is a colorless, odorless liquid with good chemical stability and adhesive properties. In semiconductor packaging materials, MMA is mainly used to prepare epoxy resin, and epoxy resin is an important part of semiconductor packaging substrates, lead frames and packaging adhesives. The excellent properties of epoxy resins, such as high mechanical strength, good electrical insulation, moisture resistance and chemical resistance, make them widely used in semiconductor packaging.

Due to the high purity requirement of MMA, it is necessary to strictly control the impurity content in the process of synthesizing epoxy resin. The presence of any impurities may cause the epoxy resin to degrade, thereby affecting the packaging quality of the semiconductor device.

2. Impurities on MMA Properties

In semiconductor packaging materials, the main impurities of MMA include water, organic matter, metal ions and other trace impurities. The presence of these impurities will have the following effects on the final epoxy resin and its packaging material:

1. Water content: Water will react with MMA to generate by-products and affect the stability of the reaction. Moisture also reduces the adhesive strength and dielectric constant of the epoxy resin, thereby reducing the insulating properties of the packaging material.

2. Organic impurities: Organic impurities may cross-link or interfere with the reaction of epoxy resin, resulting in abnormal curing rate of the resin, decreased mechanical properties, and even defects.

3. Metal ions: Metal ions (such as sodium, potassium, calcium, etc.) will react with the functional groups in the epoxy resin, resulting in changes in the conductivity and dielectric properties of the resin, affecting the reliability of the packaging material.

4. Particulate impurities: Particulate impurities may cause the surface of the epoxy resin to be uneven, affect the uniformity and surface quality of the packaging material, and even cause problems such as local short circuits or leakage.

Therefore, in the production process of MMA, the impurity content must be strictly controlled to ensure the stability and reliability of the final epoxy resin performance.

3. semiconductor packaging materials for MMA impurity control standards

In order to ensure the high quality of epoxy resin and its packaging materials, the industry has put forward strict control standards for the impurity content of MMA. These standards are mainly from the following aspects:

1. Purity requirements: The purity of MMA is usually required to be above 99.5% or even higher. The content of impurities (such as organic impurities, inorganic impurities and particulate impurities) needs to be controlled at the ppm (parts per million) level.

2. Moisture content: The moisture content in MMA is usually required to be less than 50 ppm. Excessive moisture will not only affect the curing performance of the epoxy resin, but also may cause the electrical performance of the packaging material to decrease.

3. Metal ion content: MMA metal ions (such as Na, K, Fe, etc.) need to be controlled below 1 ppm. High content of metal ions will directly affect the electrical properties and long-term stability of epoxy resin.

The industry also requires MMA to avoid contamination during production and transportation, ensuring that its physical and chemical properties meet the requirements of semiconductor packaging materials.

4. impurity control detection method and technology

In order to achieve effective control of MMA impurities, the industry has adopted a variety of detection methods and technologies:

1. Gas chromatography (GC): used to detect organic impurities and low molecular weight impurities in MMA.

2. Karl Fischer Moisture Determination: Used to accurately determine the moisture content in MMA.

3. Inductively coupled plasma mass spectrometry (ICP-AES): used to determine the content of metal ions in MMA.

These detection methods can provide a scientific basis for the impurity control of MMA and ensure its application performance in semiconductor packaging materials.

5. summary and prospect

Methyl methacrylate is an important basic raw material for semiconductor packaging materials, and its impurity control standards directly affect the performance of epoxy resin and its packaging materials. With the increasing requirements of the semiconductor industry for packaging materials, higher requirements will be put forward for the purity and impurity control of MMA in the future. By optimizing the production process, strict testing and quality control, the quality of MMA can be further improved to meet the high standards of semiconductor packaging materials.